A special heat-resistant film that combines "heat resistance" and "transparency," with low thermal shrinkage even above 200℃ and the ability to transmit light with wavelengths over 370nm!
In semiconductor manufacturing processes, heat-resistant tape for wafer protection is used, primarily made from polyester-based films such as PET. Recently, there has been an increasing demand for tapes with higher heat resistance (over 200°C) for the development of new semiconductor products and the optimization of manufacturing processes. However, polyester-based materials lack sufficient heat resistance, and polyimide films, which are heat-resistant, face challenges with transparency.
Kurabo has developed a PEEK film called "EXPEEK" that combines heat resistance and transparency, suitable for high-temperature processes exceeding 200°C in semiconductor manufacturing. This film is attracting attention from semiconductor manufacturers and tape manufacturers as it contributes to increased design flexibility in manufacturing processes.
**Features**
- The film exhibits very little dimensional change even in high-temperature environments.
- High heat resistance: Low thermal shrinkage at over 200°C, melting point 343°C, Tg (TMA) 320°C.
- High transparency: 83% total light transmittance, UV transmission starts from 370nm.
- Low water absorption: 0.07%.
*For more details, please refer to the PDF document or feel free to contact us.*
